Laser lift-off Equipment
The LLO equipment employs sophisticated optical principles and LLO technologies, incorporating excimer lasers and DPSS (Diode Pumped Solid State) laser schemes to cater to various user needs across a range of product applications. It efficiently performs selective LLO and boasts a high throughput rate.
Technical Parameters
Item
Parameter
Processed product types
GaN2
Processed product sizes
4-inch, 6-inch, 8-inch and other customized sizes.
Processing beat/cycle time
180 seconds per 4-inch
Yield rate
≥99%
UPtime
±2μm
loading and unloading methods
CST automated loading and unloading
Key Features
Multiple equipment have been delivered, and the unique process can achieve ±3μm chip peeling.
Equipment with independent intellectual property rights。
Benefits of the Product
High Quality
Stable mass production in major clients, and recognition by customers;
