Recently, the Micro LED laser mass transfer equipment independently developed by LEAD was successfully shipped and entered the process verification phase, becoming one of the only few advanced equipment to achieve mass transfer in China, representing the top level of technology in this field.
Micro LED is a new display technology after OLED. With better resolution and color saturation and lower power consumption, Micro LED has high potential for applications in VR/AR, cell phones, and tablet PCs. However, the micro LED process involves a huge amount of transfer technology which is extremely difficult to develop. Now LEAD has successfully developed laser mass transfer equipment, which has strongly promoted the rapid development of Micro LED industry.
Mass transfer technology focuses on the fast and precise transfer of millions or even tens of millions of micron-sized LED grains to the driver circuit substrate, with a good electrical connection and mechanical fixation between the driver circuit. To achieve this operation, there are a variety of technical routes to choose from. LEAD selects the laser transfer method, which uses the absorption of the laser by the material to trigger the thermal expansion of the interface, thus causing the ablation of the sacrificial layer, so that the Micro LED is transferred from the original substrate to the receiving substrate, and in the case of GaN epitaxial wafer, the GaN buffer layer at the interface will be decomposed into Ga and N2 to achieve the separation and transfer of the chip.
The equipment can achieve 99.99% yield of mass transfer and transfer accuracy within ±1um. It is compatible with 2″, 4″, 6″ wafers and a wide range of substrates at the same time.
Laser technology is an important tool for precision processing manufacturing. Since 2019, LEAD has been exploring the application of laser in various manufacturing scenarios.
In the new display field, LEAD laser equipment shipments accounted for the industry’s leading share, and has developed advanced processes such as LLO, mass welding, laser repairing, etc.
