Film Electro-deposition Machine
Electroplate and thicken the PET/PP polymer film plated with the seed copper layer
Technical Parameters
Item
Parameter
Machine dimensions
L×W×H: 32x6x3.5m
Production efficiency
8~12m/min
Power supply
20000A
Key product features
Hole<100um, coating thickness 1μm+0.1
Specifications of incoming film
PP/PET/PI, width 1250mm
coating thickness 30~100nm
base film thickness 4.5~12um
Key Features
A new conductive system with uniform coating and no new holes
Improve electro-deposition efficiency by 30% while reducing the coating thickness of incoming film, thus effectively reducing the overall product production cost
Adopt in-process dissolved pure copper and insoluble anode design, effectively improving the machine availability by 10%, saving the consumption of copper oxide powder and saving the annual cost by 1 million RMB/line
Optimize the function of edge trimming, eliminate the influence of copper powder on rewinding, and realize continuous rewinding of more than 10000m
Equipped with liquid storage tank, cold and heat exchange system and filtration system; Can be put into production without huge electro-deposition solution treatment, thus improving the machine operation efficiency and reducing the early factory investment in infrastructure
Modular design effectively improves the design and installation efficiency and greatly improves the project production efficiency
Highly intelligent system can realize the monitoring and analysis of the whole
Optional Configuration
Unwinding and splicing platform
Ultrasonic cleaning
In-process thickness measurement
In-process copper ion concentration detector
