Wafer Laser Grooving Machine adopts customized wafer dicing-specific laser(Ns&Ps options), 2-dimensional platform for linear motor, closed-loop CNC system and high-resolution CCD positioning technology to perform poly beam trimming and processing. The unique optical system thus designed ensures high-quality nondestructive cutting. The product has an independent intellectual property.

1. Multiple light source options, wide application and compatibility;
2. High multi-point diffraction efficiency, more efficient light path and laser control system;
3. Brand new automatic handling system, without wafer falling;
4. Stable laser and movement closed-loop system;
5. Continuous variable light spot and cutting width;
6. Automatic deviation correction of cutting path with a warning system;
7. Dual barrel design of cleaning and coating, improving efficiency and effect