Wafer nondestructive dicing machine uses customized inner silicon dicing laser with both penetration rate and focus quality ensured. With high-speed air floating platform, closed-loop CNC system and high-resolution CCD positioning technology, it supports LBC control of beam trimming, multi-focus and random power control to realize high quality nondestructive dicing. The product has an independent intellectual property.

1. By changing light spot shape, cutting quality and efficiency of wafer particle can be enhanced;
2. Support coaxial fast focus, rapid thickness measuring, high-speed & real-time height compensation;
3. Ceramic tray design: compatible with 8' and 12' wafers; infrared imaging module can be customized;
4. Laser: fiber optic laser, with low power consumption and purely fan cooling;
5. Modular design; each component allows customization on demand;
6. Light circuit dismantling free, installation time＜1 day